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Accelerated Mold Test on Dried Pine Sapwood Boards: Impact of Contact Heat Treatment
Luleå University of Technology. (GoFP)ORCID iD: 0000-0002-6390-7377
Luleå University of Technology.
Luleå University of Technology.
Luleå University of Technology.
2013 (English)In: Journal of wood chemistry and technology, ISSN 0277-3813, E-ISSN 1532-2319, Vol. 33, no 3, p. 174-187Article in journal (Refereed) Published
Abstract [en]

We test the hypothesis that the combination of kiln drying of double-stacked boards and contact heat treatment will reduce the susceptibility of treated boards to colonization by mold fungi. Winter-felled Scots pine (Pinus sylvestris L.) sapwood boards were double-stacked in an industrial kiln in ''sapwood out'' and ''sapwood in'' positions. Dried samples were then contact heat-treated using a hot press at three different temperatures (140°C, 170°C, and 200°C) for three different periods (1, 3, and 10 min). An accelerated mold test was performed in a climate chamber where naturally mold-infected samples were used as a source of mold inocula. Contact heat treatment degraded the saccharides that accumulated at dried surfaces, and reduced the mold growth. The threshold temperature and time for inhibiting mold growth were 170°C for 10 min. However, for industrial application, the most feasible combination of temperature and time would be 200°C for 3 min. We concluded that double stacking/contact heat treatment used is an environmentally friendly alternative to chemicals for reducing mold on Scots pine sapwood boards.

Place, publisher, year, edition, pages
Taylor & Francis, 2013. Vol. 33, no 3, p. 174-187
Keywords [en]
Accelerated mold test, climate chamber, double-stacked drying, contact heat treatment, mold grade, soluble sugar migration
National Category
Other Materials Engineering
Research subject
Technology (byts ev till Engineering)
Identifiers
URN: urn:nbn:se:lnu:diva-46540DOI: 10.1080/02773813.2013.773041OAI: oai:DiVA.org:lnu-46540DiVA, id: diva2:857465
Available from: 2015-09-29 Created: 2015-09-29 Last updated: 2019-05-20Bibliographically approved

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Ahmed, Sheikh Ali

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CiteExportLink to record
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Citation style
  • apa
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  • Other style
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  • de-DE
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